Low-Temperature Solder Readiness |
1. Introduction
The International Electronics Manufacturing Initiative (iNEMI) invites you to participate in an industry-wide survey assessing the planning and readiness levels of the industry for the implementation of low-temperature solders in high-volume board assembly. This survey focuses on the timeline to implementation, the level of effort required to ensure high-volume manufacturing capabilities, and looks to identify any open issues that need to be addressed. Results will help inform the industry on the rate of deployment of low temperature solder to date. iNEMI will also use the results to identify the key gaps requiring further investigation and define future collaborative projects to ensure supply chain and high-volume assembly readiness. A summary of survey results will be presented in an iNEMI webinar in 1Q2020.
If your company has no plans to assess low-temperature solders, we would like to know that, too. It will take approximately 10 minutes to complete the survey.
Please note: as you go through the survey, if you need to back up, use the "previous" button at the bottom of the page instead of the back button in your browser.
Participants in the survey may either self-identify or remain anonymous. If you would like to be invited to the webinar to review results, please include your contact details at the end of the survey. Any personal data collected as part of the survey will only be used to contact you in relation to the survey and related iNEMI activities, unless you indicate otherwise.
Thank you in advance for taking the time to contribute to this survey.
Participants in the survey may either self-identify or remain anonymous. If you would like to be invited to the webinar to review results, please include your contact details at the end of the survey. Any personal data collected as part of the survey will only be used to contact you in relation to the survey and related iNEMI activities, unless you indicate otherwise.
Thank you in advance for taking the time to contribute to this survey.
DEADLINE FOR INPUT: Friday, December 20